---
title: Chiplet ecosystem webinar | December 1, 2026 | TYLsemi
description: Join TYLsemi’s live chiplet ecosystem panel on December 1, 2026, at 9 AM Pacific. Explore UCIe, packaging, EDA and test for deployable AI silicon.
---

TYLsemi webinar series: Beyond the Die

![TYLsemi logo](https://pages.tylsemi.ai/hubfs/TylSemi_Logo_Horizontal_Color_Reverse-1.png)

# From concept to deployable silicon: The ecosystem view on chiplets

Explore how IP, packaging, EDA and test come together to make chiplet-based AI infrastructure practical at scale.

December 1, 2026 | 9–10 AM Pacific Time | Microsoft Teams

[Register Now](https://pages.tylsemi.ai/chiplet-ecosystem-webinar-december-1-2026#registration)

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Moderated by TYLsemi, with panelists from:

![InPsy logo](https://pages.tylsemi.ai/hs-fs/hubfs/InPsy%20logo.png?width=1353&height=678&name=InPsy%20logo.png)

![proteanTecs logo](https://pages.tylsemi.ai/hs-fs/hubfs/proteanTecs%20logo.png?width=1255&height=484&name=proteanTecs%20logo.png)

![Siemens logo](https://pages.tylsemi.ai/hs-fs/hubfs/Siemens%20logo-1.png?width=1475&height=422&name=Siemens%20logo-1.png)

## See how the chiplet ecosystem reaches production

 

AI infrastructure has outgrown the monolithic chip. As designs push against reticle limits, the industry is moving to multi-die architectures built from chiplets, and standards like UCIe for D2D connectivity, together with advances in packaging, are making that shift practical today. But turning chiplets into deployable silicon takes more than any one company. It takes IP, packaging, EDA and test working as one.

 

In this live panel, TYLsemi CEO Mohit Gupta leads a candid conversation with leaders from the chiplet ecosystem on where chiplet-based design really stands: what is working in production, where the hard problems remain, and what it will take to make chiplet-based AI infrastructure practical at scale.

## What you’ll learn

- **Adoption in production.** See what is deployed today and what is still emerging.
- **UCIe and open standards.** Understand how standards enable multi-vendor, interoperable chiplet designs.
- **Packaging and integration.** Examine choices that shape performance, power and cost.
- **Your first steps.** Identify ways to adopt chiplets using components from the ecosystem.

## Your moderator and panel

Hear perspectives from across IP, packaging, EDA and test in a candid conversation about chiplet-based design.

![Mohit](https://pages.tylsemi.ai/hs-fs/hubfs/Mohit.png?width=160&height=160&name=Mohit.png)

Moderator

Mohit Gupta

CEO  
TYLsemi

![undefined](https://pages.tylsemi.ai/hs-fs/hubfs/undefined.jpeg?width=160&height=160&name=undefined.jpeg)

Panelist

Howard Ro

Executive Vice President  
InPsy

![Nir Sever proteanTecs Senior Director Business Development](https://pages.tylsemi.ai/hs-fs/hubfs/Nir%20Sever%20proteanTecs%20Senior%20Director%20Business%20Development.png?width=160&height=160&name=Nir%20Sever%20proteanTecs%20Senior%20Director%20Business%20Development.png)

Panelist

Nir Sever

Senior Director of Business Development  
proteanTecs

![Piyush Sancheti\_new\_headshot (hir res)](https://pages.tylsemi.ai/hs-fs/hubfs/Piyush%20Sancheti_new_headshot%20(hir%20res).png?width=160&height=160&name=Piyush%20Sancheti_new_headshot%20(hir%20res).png)

Panelist

Piyush Sancheti

Vice President of Central Engineering Solutions Group  
Siemens EDA

## Webinar details

### When and where does the webinar take place?

Join the live panel on December 1, 2026, from 9 to 10 AM Pacific Time on Microsoft Teams. The one-hour session brings together perspectives from across the chiplet ecosystem, with Mohit Gupta, CEO of TYLsemi, moderating the conversation about deployable silicon.

### What topics will the panel cover?

You’ll hear about chiplet adoption in production, UCIe and open standards, and packaging and integration. The discussion also covers practical first steps for adopting chiplets and how ecosystem collaboration supports chiplet-based AI infrastructure at scale.

## Save your spot for December 1

Join the live conversation from 9 to 10 AM Pacific Time and explore your next steps in chiplet-based design.

TYLsemi

From concept to deployable silicon: The ecosystem view on chiplets | December 1, 2026